1999 IEEE.
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IEEE Microwave and Guided Wave Letters
Volume 9 Number 11, November 1999
Table of Contents for this issue
Complete paper in PDF format
Ultrabroad-Band Vertical Transition for Multilayer Integrated Circuits
Lei Zhu, Member, IEEE, and Ke Wu, Senior Member, IEEE
Page 453.
Abstract:
A vertical transition using wide-aperture coupling is
proposed for ultrabroad-band design of multilayer integrated circuits.
With an electrically wide aperture formed on the common ground plane of
two-layered microstrip line structures, a significant enhancement of
capacitively series coupling is observed at low frequency. This simple
technique realizes a very flat frequency response of transmission over a
very broad bandwidth. A two-layered transition is accurately
characterized by applying a so-called "short-open
calibration" (SOC) scheme to calibrate numerical results obtained
from a full-wave method of moments (MoM). The transition shows several
attractive features such as ultrabroad bandwidth, low radiation loss,
and deep up-band rejection. Predictions are well verified by
measurements over a wide frequency range.
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