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IEEE Microwave and Guided Wave Letters
Volume 9 Number 11, November 1999

A Drop-On Band-Pass Filter for Millimeter-Wave Multichip Modules on LTCC

Page 456.

Abstract:

Low-temperature cofired ceramic (LTCC) is increasingly used to realize multichip modules (MCM's), even in the millimeter (mm)-wave frequency range. Fabrication tolerances of standard LTCC structures, however, still are limiting the performance of band-pass filters integrated directly on the LTCC substrate. This contribution therefore describes the design and the performance of a separate filter chip based on alumina which simply is placed on top and glued to the LTCC substrate using nonconductive epoxy. A special electromagnetic field coupling is used to provide both the interconnect of signal lines and filter ground. The design includes special measures to reduce the tolerance requirement for filter placement and glue thickness.

References

1. R. L. Brown, P. W. Polinski, and A. S. Shaikh, "Manufacturing of microwave modules using a low-temperature cofired ceramics," in Proc. IEEE Int. Microw. Symp. MTT-S, 1994, San Diego, CA, pp. 1727-1730.
2. B. K. Gilbert and G.-W. Pan, "MCM packaging for present- and next-generation high clock-rate digital- and mixed-signal electronic systems: Areas for development," IEEE Trans. Microwave Theory Tech., vol. 45, 1997, pp. 1819-1835.
3. A. Fathy et al., "Design of embedded passive components in low-temperature cofired ceramic on metal (LTCC-M) technology," in Proc. IEEE Int. Microw. Symp., 1998, Baltimore, MD, pp. 1281-1284.
4. W. Menzel, "Packaging and interconnect techniques for complex millimeter-wave front-ends," in Proc. 28th Europ. Microw. Conf., 1998, Amsterdam, The Netherlands, vol. 2, pp. 497-502.
5. G. Strauß and W. Menzel, "Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling," IEEE Trans. Comp., Packag., Manufact. Technol.--Part B, vol. 19, pp. 278-282, May 1996.
6. W. Menzel, "Broadband filter circuits using an extended suspended substrate transmission line configuration," in Proc. 22nd Europ. Microw. Conf., 1992, Helsinki, Finland, pp. 459-463.
7. W. Menzel, H. Schumacher, W. Schwab, and X. Zhang, "Compact multilayer filter structures for co-planar MMIC's," IEEE Microwave Guided Wave Lett., vol. 2, pp. 497-498, Dec. 1992.