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IEEE Microwave and Guided Wave Letters
Volume 10 Number 8, August 2000

Table of Contents for this issue

Complete paper in PDF format

Batch Transfer Integration of RF Microrelays

Veljko Milanović, Michel Maharbiz and Kristofer S. J. Pister

Page 313.

Abstract:

This letter presents the first implementation of batch-transferred microrelays for a broad range of RF applications and substrates. The transferred relays include two types of electrostatic pull-down structures for series and shunt switching of a CPW. The batch-transfer methodology allows integration of optimized microelectromechanical systems (MEMS) in RF systems on substrates such as sapphire, GaAs, and even CMOS. Gold-to-gold contact series microrelays with insertion loss of <0.3 dB, and isolation better than 15 dB at frequencies from 100 MHz to 50 GHz are demonstrated,as well as shunt switches with >45 dB of isolation and <0.3 dB insertion loss in that frequency range.

References

  1. C. T.-C. Nguyen, L. P. B. Katehi and G. M. Rebeiz, "Micromachined devices for wireless communications", Proc. IEEE, vol. 86, no. 8, pp.  1756-68, Aug.  1998.
  2. L. P. B. Katehi, G. M. Rebeiz and C. T.-C. Nguyen, "MEMS and Si-micromachined components for low-power, high-frequency communications systems", 1998 IEEE MTT-S Int. Microwave Symp. Dig., vol. 4, pp.  331-333,  Jun.  1998.
  3. Z. J. Yao, S. Chen, S. Eshelman, D. Denniston and C. Goldsmith, "Micromachined low-loss microwave switches", J. Microelectromech. Syst., vol. 8, no. 2, pp.  129-34, June  1999.
  4. D. Hyman, A. Schmitz, B. Warneke, T. Y. Hsu, J. Lam, J. Brown, J. Schaffner, A. Walston, R. Y. Loo, G. L. Tangonan, M. Mehregany and J. Lee, "GaAs-compatible surface-micromachined RF MEMS switches", Electron. Lett., vol. 4, pp.  1507-10,  June  1999.
  5. J. B. Muldavin and G. M. Rebeiz, "30 GHz tuned MEMS switches", 1999 IEEE MTT-S Int. Microwave Symp. Dig., vol. 4, pp.  1511-1514, June  1999.
  6. K. Suzuki, S. Chen, T. Marumoto, Y. Ara and R. Iwata, "A micromachined RF microswitch applicable to phased-array antennas", 1999 IEEE MTT-S Int. Microwave Symp. Dig., vol. 4, pp.  1923-1926, June  1999.
  7. K. F. Harsh, W. Zhang, V. M. Bright and Y. C. Lee, "Flip-chip assembly for Si-based RF MEMS", in Proc. 12th IEEE Int. Conf. Microelectromechanical Systems (MEMS `99), Orlando, FL, Jan. 1999, pp.  273-278. 
  8. Z. Feng, W. Zhang, B. Su, K. F. Harsh, K. C. Gupta, V. Bright and Y. C. Lee, "Design and modeling of RF MEMS tunable capacitors using electro-thermal actuators", 1999 IEEE MTT-S Int. Microwave Symp. Dig., vol. 4, pp.  1507-10, June  1999.
  9. M. M. Maharbiz, R. T. Howe and K. S. J. Pister, "Batch transfer assembly of micro-components on surface and SOI MEMS", in Transducers '99, Sendai, Japan,June 7-10 1999, pp.  1478-81. 
  10. M. M. Maharbiz, M. B. Cohn, R. T. Howe, R. Horowitz and A. P. Pisano, "Batch micropackaging by compression-bonded wafer-wafer transfer", in MEMS '99, Orlando, FL, Jan. 17-21 1999, pp.  482- 9. 
  11. A. Singh, D. Bilic and R. T. Howe, "Performance evaluation of batch-transferred surface micromachined resonators", in Transducers '99, Sendai, Japan,June 7-10 1999, p.  1158. 
  12. R. B. Marks, "A multiline method of network analyzer calibration", IEEE Trans. Microwave Theory Tech., vol. 39, pp.  1205-1215, July  1991.