2000 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

IEEE Transactions on Microwave Theory and Techniques
Volume 48 Number 9, September 2000

77-GHz-Band Surface Mountable Ceramic Package

Page 1488.

Abstract:

The authors have developed a surface mount-type ceramic package for 77-GHz millimeter-wave application. The package has a new terminal structure for surface mount and a feedthrough of electromagnetic coupling. The authors have adopted a coplanar structure for the surface mount terminal. The structure for the electromagnetic coupling consists of microstrip line/slot/microstrip line (MSL/SLOT/MSL). Total transmission loss between the signal line on board and the RF input-output terminal inside the package was 1.0 dB at 77 GHz. Standard deviation of the insertion loss was 0.08 dB (n = 57). The authors have confirmed that the surface mountable package shows high transmission characteristics as well as high reliability.

References

1. N. Vandenberg and L. Katehi, "Broadband vertical interconnects using slot-coupled shielded microstrip lines", IEEE Trans. Microwave Theory Tech., vol.  40, pp.  81-88, Jan.  1992.
2. M. Herman, et al. "Novel techniques for millimeter-wave packages", IEEE Trans. Microwave Theory Tech., vol. 43, pp.  1516-1523, July  1995.
3. G. Strauss and W. Menzel, "Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling", IEEE Trans. Compon.,Packaging, Manuf. Technol. B, vol. 19, pp.  278-282, May  1996.
4. S. Koriyama, K. Kitazawa and M. Fujii, "Development of a package utilizing an electromagnetic coupling structure", 1998 IEEE MTT-S Int. Microwave Symp. Dig., pp.  1087-1090,