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IEEE Microwave and Guided Wave Letters
Volume 10 Number 2, February 2000

Table of Contents for this issue

Complete paper in PDF format

Impact of Test-Fixture Forward Coupling on On-Wafer Silicon Device Measurements

Troels Emil Kolding Member, IEEE

Page 73.

Abstract:

Often, the test-fixture forward coupling is ignored during on-wafer device measurements, although existing de-embedding techniques provide means for addressing its effect. In this letter it is demonstrated that large errors may occur if forward coupling is not determined and accounted for. An investigation based on basic scaling properties of MOSFET's is proposed as a benchmark test to partially verify de-embedding methods.

References

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  2. C.-H. Kim, C. S. Kim, H. K. Yu and K. S. Nam, "An isolated-open pattern to de-embed pad parasitics", IEEE Microwave Guided Wave Lett., vol. 8, pp.  96-98, Feb.  1998.
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