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IEEE Transactions on Microwave Theory and Techniques
Volume 48 Number 9, September 2000

Table of Contents for this issue

Complete paper in PDF format

Millimeter-Wave Silicon MMIC Interconnect and Coupler Using Multilayer Polyimide Technology

Juno Kim, Student Member, IEEE Yongxi Qian, Member, IEEE Guojin Feng, Pingxi Ma, M. Frank Chang, Fellow, IEEE and Tatsuo Itoh Fellow, IEEE

Page 1482.

Abstract:

This paper reports our latest progress in developing low-loss and low-crosstalk silicon MMIC interconnects for millimeter-wave applications. The proposed silicon/metal/polyimide (SIMPOL) structure based on multilayer polyimide technology is extremely effective in reducing noise crosstalk, and also provides very low line loss, even at the millimeter-wave regime. The measurement results of the developed SIMPOL structures demonstrate extremely low noise crosstalk (< -40 dB) in the entire frequency range (up to 50 GHz), which is limited by the dynamic range of the measurement equipment, and excellent insertion loss (<-0.25 dB/mm) up to 45 GHz. In addition, the SIMPOL concept is applied for the first time successfully in the design and fabrication of branch-line hybrids at millimeter-wave frequencies, 30 and 37 GHz.

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