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IEEE Transactions on Microwave Theory and Techniques
Volume 48 Number 10, October 2000

Table of Contents for this issue

Complete paper in PDF format

Three-Dimensional High-Frequency Distribution Networks-Part II: Packaging and Integration

Rashaunda M. Henderson, Member, IEEE Katherine J. Herrick, Member, IEEE Thomas M. Weller, Member, IEEE S. V. Robertson, R. T. Kihm and Linda P. B. Katehi Fellow, IEEE

Page 1643.

Abstract:

This paper describes the implementation and packaging of the components, desribed in Part I of this paper, to realize a three-dimensional W-band distribution network.

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